The Use of IR Soldering Stations in the Process of Disassembling in BGA Packaging

eng Artykuł w języku angielskim DOI: 10.14313/PAR_236/59

wyślij Piotr Witkowski Politechnika Opolska, Wydział Elektrotechniki, Automatyki i Informatyki

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Abstract

This article presents the definition of a soldering profile and its division into individual phases. For the purpose of this article, an experiment was performed in which the influence of various factors such as – BGA package size, PCB size, the type of solder – on the temperature profile of a soldering process was investigated. The article is an overview and can serve as a guidebook for people who use soldering stations in their daily work to disassemble systems in BGA packages, or who plan to use such machines in their research

Keywords

circuit disassembly, FCBGA, IR soldering station, printed circuit board, reflow soldering

Zastosowanie stacji lutowniczych IR w procesie demontażu układów w obudowach BGA

Streszczenie

W artykule przedstawiono definicję profilu lutowniczego oraz jego podział na poszczególne fazy. Na potrzeby artykułu przeprowadzono eksperyment, w którym zbadano wpływ różnych czynników na proces demontażu/montażu, takich jak: wielkość układu BGA, wielkość płytki drukowanej, rodzaj spoiwa, dobrany profil temperaturowy. Artykuł ma charakter poglądowy i może służyć jako przewodnik dla osób, które w codziennej pracy wykorzystują stacje lutownicze do demontażu układów w obudowach BGA lub planują wykorzystanie takich maszyn w swoich badaniach.

Słowa kluczowe

demontaż układów, FCBGA, grzałka na podczerwień, płyta drukowana, stacja lutownicza

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